Email: info@bec-sales.com
Tel: 408 624 1222
cutomized electroplating stations
MANUAL SYSTEMS
SEMI-AUTOMATED SYSTEMS
FULLY AUTOMATED SYSTEMS
CUSTOMIZED ELECTROPLATING STATIONS


INNOVATIVE,
CUSTOM DESIGNED ELECTROPLATING SOLUTIONS

 

Why spend for off-the-shelf electroplating systems when you can invest your valuable CapEx in a customized system engineered to exceed your process requirements and moreover your operational cost requirements. TOSETZ is committed to providing customers highly advanced, reliable electroplating products, engineering services and the utmost customer support. The Tosetz technology is not limited to Vertical wafer positions but also Face-Up configurations to provide customers with the most flexibility of any electroplating solution.

The technology designed into our electroplating stations set the standard for ultra-thin films with unsurpassed uniformity. Advanced electroplated methods have been developed for materials such as, but not limited to, Permalloys, Cu and Au, just to name a few, used in the manufacturing of advanced Hard Disk Drive (HDD) recording heads and Ni and Cu used in semiconductor device manufacturing process. Process technologies include TSV’s, Damascene, Interposers, Micro Bumping and MEMS.

The company’s large installed base are located in Japan and the United States of America.

thickness map custom electroplating stations

 

Be welcome to watch
our video about

Automated Tri-Alloy Plating

 

SOLVING ELECTROPLATING CHALLENGES

 


What our customers are looking for:
  • Improvement of present plating stations and support
  • Change of sputter process to plating process
  • Use plating system for new or next generation products
  • Like a trial plating and evaluation with demo-tool as a first step
  • Change the pilot system to production plating system

Our Commitment:
  • Tosetz will design customized electroplating stations that exceed the expectations of the customer
  • Tosetz will propose optimized solutions to reduce cost, and improve delivery time
  • Tosetz will provide outstanding applications and field service support


The Tosetz Advantage

  • Unrivaled electroplating film uniformity
  • Repeatability of plating film (wafer to wafer)
  • Plating for narrow and deep holes
  • Applications support
  • Custom layout design, footprint, throughput
  • Variety of tools (manual, semi-auto, fully automated tools)
  • Problem solving in plating technologies
  • Support


Demo Stations:

We offer demo stations to accelerate the development process. Please contact us for more details: 408 624 1222 or
download Tosetz brochure



Tosetz Electroplating Custom Tool Applications & Configurations


Application Features Plating material Wafer size Custom Design

GMR
PMR
TMR
  • Up-Face & Paddle type
  • High Field Magnet
  • Deflector Cathode
  • Excellent Thickness Uniformity
  • HVM: High volume manufacturing
  • NiFe, Cobalt, Tri-Alloy



NiFe, Cobalt,
Tri-Alloy

 

3-in to 8-in
AlTiC
  • Automated
  • 8-in x 2 Cells
  • C to C

  • Automated
  • 6-in x 4 Cells
  • C to C

Electoronic
Parts
  • Up-Face & Paddle type
  • Deflector Cathode
  • Excellent Thickness Uniformity
  • HVM: High volume manufacturing

 

Ni, Cu


3-in to 8-in
Ferrite wafer
  • Automated
  • 8-in x 4Cells
  • C to C

Electoronic Parts
  • Vertical dip & Paddle
  • Excellent Thickness Uniformity
  • HVM: High volume manufacturing


Ni, Au, Cu

4-in, 6-in
Piezoelectroric
wafer
  • Semi-automated
  • 4-in, 6-in
  • 9Cells(Ni) x2 Cells(Au)

TSV
  • Up-Face & Paddle type
  • Deflector Cathode
  • Excellent Thickness Uniformity


Cu

4-in to 12-in
Silicon wafer
 

PV
  • Vertical dip & Paddle
  • Excellent Thickness Uniformity
  • HVM: High volume manufacturing


Cu, Sn

6-in
Silicon wafer
 

** Please inquire about your requirements for 12-inch and 17-inch substrates ( 408 624 1222 ) or download Tosetz brochure