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Introduction

EG6000t

EG4090u+

Film Frame

Upgrades

ELECTROGLAS WAFER PROBING TECNHOLOGY
EG 6000t
EG4090u+
FILM FRAME
UGRADES
Wafer & Device Probers


ELECTROGLAS WAFER PROBING TECNHOLOGY EMERGES

 

 

Global SemiFab Solutions (GSS) continues a long tradition spanning four decades of probing experience by providing advanced probing test solutions to the semiconductor industry. These companies rely on this capability to solve product and manufacturing challenges with fast and reliable test data. High-volume and low-cost manufacturing translates to a highly repeatable, accurate and reliable probing platform.  The stringent requirements of a manufacturing probe and test operation requires GSS to deliver a production ready wafer prober that can achieve the required results.

ELECTROGLAS WAFER PROBING TECNHOLOGY

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Wafer & Device Probers


MOST ADVANCED 300MM WAFER PROBING PLATFORM

 

The EG6000t 300mm wafer prober boast the best of breed prober technology combining automation with the most accurate production prober. Designed to meet the production challenges of the industry the EG6000t 300mm wafer prober highlights a reliable, accurate, high-throughput platform for real-world test environments.

  • With the combination of "one-button" probing and robust critical functions, the set-up and operation are simplified.
  • The fast lot-start to lot-end throughput creates the fastest throughput in the industry.
  • Precision direct-drive technology results in the industry's highest probing accuracy.
  • Excellent design for low maintenance and high mean time between failures or adjustment.
  • The machine can be easily moved so that testing operations can be resumed without re-calibration.
  • Testing of sensitive Cu and low K dielectric devices are both accurate and safe.
ELECTROGLAS WAFER PROBING TECNHOLOGY

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Wafer & Device Probers


UNRIVALED SOLUTION FOR 200MM WAFER PROBING PRODUCTIVITY

 

To maximize the CapEx in 200mm wafer probing equipment, device makers require accurate and reliable high-volume probing. The 4090µ+ addresses these demands by reducing test costs through increased throughput, simplified operations and state-of-the-art automation.
  • MicroTouchTM soft contact technology reduces pad damage
  • "One-button" probing and self-calibration results in an efficient and simplified operation.
  • Increased test cell availability and throughput reduces test costs.
  • Probe camera optics and the Advanced Vision System (AVS) provides increased probe card alignment speed and accuracy.
  • Advanced features address the testing demands of fine-pitch devices, copper interconnects, low-k dielectrics and other advanced applications.
ELECTROGLAS WAFER PROBING TECNHOLOGY

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Wafer & Device Probers


MOST ADVANCED, AUTOMATED WAFER, DIE AND PACKING PROBER

 

After dicing, device quality needs to be ensured by accurately testing known-good die, wafer-level packages and microelectromechanical systems (MEMS). Film Frame is the most advanced, fully automated wafer, die and package test-handling system that enables chipmakers to maximize efficiency, yield and profit.

  • Introduces a new level of automation to die and package testing based on the 200mm Prober technology.
  • Packaged device strips or panels can be accurately tested when mounted on film in industry-standard film frames.
  • The ability to test die in multiple configurations of package strips reduces costs by saving valuable test time during Ball grid array (BGA), micro ball grid array (MBGA) and chip scale packages (CSP).
  • Fragile substrates or ultra-thin wafers can be tested without risk of breakage or micro-cracking.
ELECTROGLAS WAFER PROBING TECNHOLOGY

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Wafer & Device Probers


MAXIMIZING 200MM CapEX BY EXTENDING PERFORMANCE

 

“Plus" Upgrade Package:
Upgrade to "Plus" from 4090, and 4090u probers

  • MicroTouchTM soft contact technology provides reduced pad damage.
  • Enhanced X, Y, Z accuracy.
  • Automatically adjusts alignment after thermal transitions providing superior thermal agility.
  • Automatic Probe To Pad Alignment (APTPA) is faster.
  • Advanced Vision System (AVS) See below.

Advanced Vision System (AVS) Upgrade Package:
Upgrade to AVS from 4080, 4090, and 4090u probers
  • Better and faster wafer alignment.
  • Advanced automation features.
  • Improved cleaning features.


Additional Upgrade Packages available:
  • Vortex chuck for testing down to 20C and fast cooling.
  • EG hot chuck 150C support (from 130C).
  • Blow/cool kit for faster chuck cooling.
  • Easy Planar Scrub blocks.
  • Probe tip cleaning brush.